Plasma deposition of organosilicon polymer thin films with embedded nanosilver for prevention of microbial adhesion

Abstract : Composite thin films (~170 nm) containing silver nanoclusters embedded in an organosilicon matrix were deposited by PE-CVD onto stainless steel in order to prevent microbial adhesion. The process originality relies on a dual strategy combining silver sputtering and simultaneous plasma polymerization in argon–hexamethyldisiloxane (HMDSO) plasma, using an asymmetrical RF glow discharge. The metal content in the film was controlled by varying the HMDSO flow rate. Investigation of the physicochemical properties of the obtained films was conducted by X-ray photoelectron spectroscopy and transmission FTIR spectroscopy. Plasma-mediated coatings were composed of C, O, Si and Ag which was predominantly under metallic form, as indicated by XPS analysis. The presence of Si–H, Si–O–Si, Si–(CH)n–Si and C–H groups was established by FTIR. The yeast Saccharomyces cerevisiae was selected as the model for eukaryotic microorganisms. The maximal anti-adhesive efficiency was achieved for the organosilicon matrix alone. When nanosilver was incorporated into the organic matrix, the efficiency was reduced, especially for high metal contents. Silver antimicrobial property was assumed to be related to Ag+ progressive release from the embedded nanoparticles into the surrounding medium. This release was confirmed by ICP-MS measurements. Moreover, silver-containing film antifungal activity was observed towards sessile cells.
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https://hal-agroparistech.archives-ouvertes.fr/hal-01563939
Contributeur : Claire Saulou-Bérion <>
Soumis le : mardi 18 juillet 2017 - 13:02:38
Dernière modification le : mercredi 28 février 2018 - 10:23:00

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Claire Saulou, Bernard Despax, Patrice Raynaud, Sandrine Zanna, Philippe Marcus, et al.. Plasma deposition of organosilicon polymer thin films with embedded nanosilver for prevention of microbial adhesion. Applied Surface Science, Elsevier, 2009, 256 (3 Supplement), pp.S35-S39. 〈10.1016/j.apsusc.2009.04.118〉. 〈hal-01563939〉

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